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Precise laser processing for BGA rework manufacturing
发布时间:2018-04-09 10:54:21浏览次数: Article source : Editor's release time : 2018-04-09 10: 54: 21Views

                               Precise laser processing for BGA rework manufacturing

武汉博联特全球首创激光BGA返修系统 ----- Wuhan Boliante World's First Laser BGA Rework System  

                                   

With the development of 3C electronic products more and more thin and light, PCB motherboards and electronic components, including BGA chips, must also develop toward high-density, thin design. When traditional infrared and hot air are used for disassembly and welding of BGA chips, the large-area heating and uncontrollable wind direction of hot air can easily cause adjacent or back-mounted BGA chips to re-melt over-temperature twice, resulting in failure of BGA chip performance. With its high directivity and small divergence angle, the laser has completed the disassembly and welding of the high-density BGA chip's front and back stickers with the high-precision temperature control system developed by our company.

   Non-contact welding, no stress, no pollution, fast temperature rise, small heat affected area;

控制,可视化操作; PC control, visual operation;

Coaxial temperature control, temperature feedback, real-time monitoring of BGA chip temperature, constant temperature control, precision soldering.

Application scenario

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                        Double-layer BGA Single-layer BGA Pro Sticker BGA Back Sticker

、BGA芯片最小禁布可达0.8mm. 1.The minimum forbidden cloth of BGA chip can reach 0.8mm.

、背贴BGA芯片PCB板厚度可薄至0.5mm. 2.The thickness of the back-mounted BGA chip PCB board can be as thin as 0.5mm.

 

     Wuhan Boliante has been committed to the development and special research of special laser precision machining products. Combining the company's strong R & D background and university support, it has developed a series of laser precision machining and laser automation products to make up for the gaps in many industries. Won the praise of many Fortune 500 companies.

     Due to the high density and high integration of BGA designs (many functional requirements) that are commonly found in the 3C market (mobile phones, smart wearables, etc.), the traditional method of disassembly and welding of BGAs is not high, and there are many cores. The scrapping of devices has sacrificed numerous costs and resources.

℃。 The BGA rework system developed by Wuhan Bolian uses laser non-contact heating and a small heat radiation surface, coupled with the uniqueness of coaxial temperature control, to ensure that the temperature of the solder balls inside the BGA is lower than 200 ℃. 任意变换加工路径的方便性,能适应不同大小尺寸的BGA拆焊。 The convenience of being able to change the processing path arbitrarily, can adapt to different size BGA desoldering. It effectively solves the problem of desoldering and soldering of BGA, greatly improves the yield, saves the manufacturing cost, and directly improves the product utilization rate.

 

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