First, the application scenario
Advantages of constant temperature laser desoldering BGA
With the development of 3C electronic products more and more thin and light, PCB motherboards and electronic components, including BGA chips, must also develop toward high-density, thin design. When traditional infrared and hot air are used for disassembly and welding of BGA chips, the large-area heating and uncontrollable wind direction of hot air can easily cause adjacent or back-mounted BGA chips to re-melt over-temperature twice, resulting in failure of BGA chip performance. With its high directivity and small divergence angle, the laser cooperates with the temperature control system independently developed by our company to make up for the disassembly and welding of the high-density BGA chip front and back stickers.
◆ Non-contact welding, no stress, no pollution, fast temperature rise, small heat affected area;
◆ PC control, visual operation;
◆ Coaxial temperature control, temperature feedback, real-time monitoring of BGA chip temperature, constant temperature control, precise soldering and disassembly.
1. Wuhan Boliante Laser is responsible for free installation, commissioning and training of technical staff for the equipment purchased by customers.
2. Wuhan Bolian Special Laser's service network spreads all over the country. Any customer's problems will be responded within 8 hours and resolved within 24 hours.
3. Wuhan Boliante Laser provides one year free warranty and lifetime warranty service to provide customers with first-class products, first-class quality and first-class service.
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