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Laser soldering-connector soldering process application new highlights
发布时间:2018-11-08 15:31:20浏览次数: Article source : Editor's release time : 2018-11-08 15: 31: 20Views


    3C 产品日益成熟, 越来越成为人们最为依赖的工具,由于需求的增加,要求新的 3C产品越来越集成化,多功能化以及小巧化,使得 该领域所涵盖的产品其所包含的任何元器件都或许会涉及到锡焊工艺,大到 PCB板主件,小到晶振元件,绝大多数的焊接需要在300℃以下完成。 With the current maturity of 3C products, it has become more and more a tool that people rely on. Due to the increase in demand, new 3C products are becoming more integrated, multifunctional, and compact, making the products covered in this field Any components included may involve soldering processes, ranging from PCB board main components to crystal oscillator components. The vast majority of soldering needs to be completed below 300 ° C. Traditional soldering methods have been increasingly unable to meet these needs. Under this application background, the application of laser soldering has become a highlight tool for many connector application manufacturers, and they have attracted Apple, Huawei, etc. An important weight for front-line manufacturers.

激光锡焊 具有加热速度快,热输入量及热影响小;焊接位置可精确控制; 焊接温度恒温可控, 焊接过程自动化;可精确控制钎料的量,焊点一致性好;可大幅减少钎焊过程中的挥发物对操作人员的影响;非接触式加热;适合复杂结构零件焊接等优点 Compared with the traditional soldering process, laser soldering has fast heating speed, small heat input and small thermal impact; the welding position can be accurately controlled; the welding temperature can be controlled at a constant temperature, and the welding process can be automated; the amount of solder can be accurately controlled, and the welding points are consistent Good performance; can greatly reduce the effect of volatiles on the operator during brazing; non-contact heating; suitable for welding complex structural parts and other advantages .

In response to the needs of our customers, Wuhan Bolian has continuously developed and improved laser soldering equipment and launched a series of industrial application equipment. HDMI, TYPE-C,苹果LINGTING,USB等等互联应用的激光锡焊工艺,得到了越来越多的一线厂家认可。 In response to the needs of electronic interconnection, laser soldering processes have been developed for high-speed HDMI, TYPE-C, Apple Lingting, USB and other interconnection applications, which have been recognized by more and more first-line manufacturers.

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