With the miniaturization of electronic devices and integrated circuits, high-density interconnects continue to challenge traditional reflow soldering methods. How to successfully complete the welding of each small soldering leg in high-density interconnection without causing adhesion between adjacent soldering legs and thermal damage to the circuit board, using laser for non-contact soldering has become one of the solutions. In the past, most lasers capable of providing sufficient power were bulky and expensive to perform routine maintenance, which made them impractical.
PCB 板主件，小到晶振元件，绝大多数的焊接需要在 300 ℃以下完成。 With the development of science and technology, electronic, electrical, and digital products have become increasingly mature and popular all over the world. Any component included in the products covered by this field may involve soldering processes, ranging from PCB main components to crystal oscillator For components, most of the soldering needs to be completed below 300 ℃.
IC 封装）和板卡级的组装均大量采用锡基合金填充金属进行焊接，完成器件的封装与卡片的组装。 At present, the chip-level package ( IC package) and board-level assembly of the electronics industry are mostly soldered with tin-based alloy filler metals to complete device packaging and card assembly. PCB 焊接面相接触完成焊接过程；回流焊则是将钎料膏或焊片事先放置在 PCB 焊盘之间，加热后通过钎料膏或焊片的熔化将元件与 PCB 连接起来。 For example, in the flip chip process, the solder directly connects the chip to the substrate; in electronic assembly manufacturing, the solder is used to solder the device to the circuit substrate. The soldering process includes wave soldering and reflow soldering . Wave soldering is The crest surface of the circulating flow of molten solder is used to contact the PCB soldering surface with the inserted components to complete the soldering process; reflow soldering is to place solder paste or pads between the PCB pads in advance , and then pass through the solder after heating. The melting of the paste or solder pad connects the component to the PCB . 是以激光作为热源，熔融锡使焊件达到紧密贴合的一种钎焊方法。 Laser soldering is a brazing method that uses laser as the heat source and melts the tin to make the welded parts close to each other.
Compared with the traditional soldering process, this method has fast heating speed, small heat input and small thermal impact; the welding position can be accurately controlled; the welding process can be automated; the amount of solder can be accurately controlled, and the solder joint consistency is good; it can greatly reduce soldering The effects of volatiles during welding on the operator; non-contact heating; suitable for welding complex structural parts. Laser soldering uses laser heat source as the main body, fills and melts the tin material to achieve the process effect of connection, conduction and reinforcement.
Wuhan Boliante is mainly engaged in the research, development, production and sales of semiconductor laser-based welding, marking, curing and other series of laser equipment, providing customers with a wealth of non-standard laser products and customized equipment. The company's main products are: laser soldering series (laser soldering machine): constant temperature laser soldering machine, laser ball soldering, laser reflow soldering, spot soldering integrated equipment; laser automation series: network filter automation production line, TYPE- C Automated Laser Processing, Automated Laser Welding of Optical Modules, Automated Processing of Smart Wearable Lasers; BGA Laser Rework System; Laser Plastic Welding Series; Laser Welding Series; Laser Panel Series; Laser Fixed Screen Series; Laser Marking Series: Fiber Laser Marking Marking machine, UV laser marking machine. kchqi.com Company website: kchqi.com