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Application advantages of laser spray soldering system in 3C products
发布时间:2017-11-30 13:27:43浏览次数: Article source : Editor's release time : 2017-11-30 13: 27: 43Views

Introduction : As new technologies such as FPC and LDS are thinner and lighter, they have become more and more popular in the application of 3C products, making the base material of traditional solder pads unable to withstand excessive temperatures. In this way, traditional manual soldering irons, reflow soldering and other technologies have been unable to adapt to the production of such materials. The development of a new type of laser ball soldering system has changed from time to time and has taken advantage of the situation, which has greatly enhanced the development of China's 3C electronics industry. Advantage.

With the improvement of IC chip design level and manufacturing technology, electronic products are moving towards the miniaturization of high density and high reliability. At present, the center distance of the pins of QFP has reached 0.3mm, and the number of pins of a single device can reach more than 576. This makes the traditional welding methods such as traditional gas phase reflow welding, hot air reflow welding, and infrared reflow welding very easy to "bridge" adjacent lead solder joints when welding such fine-pitch components. At the same time, the base material of traditional solder pads cannot withstand excessive temperatures. In this way, traditional manual soldering iron, reflow soldering and other technologies have been unable to adapt to the production of such materials.

Laser ball soldering system 3C industry application advantages

Laser ball soldering technology uses a single tin ball separated by a combination of laser and inert gas to spray molten tin material droplets at a certain temperature onto the metalized pad to precisely spray the surface of the area to be soldered. The heat carried by the ball droplets heats the pads to form bumps or to achieve bonding. The main advantage of this process is that it can achieve very small size interconnections, and the droplet size can be as small as tens of microns; the solder ball distribution and heating processes are performed simultaneously, and the production efficiency is high; through digital control of the solder balls, spraying can be achieved Precise position control to achieve extremely small-pitch interconnections; the heating of solder ball droplets is local and has no thermal impact on the package as a whole; in addition, no tool contact is required during the connection process, which prevents the device from contacting the surface of the device and causing the device Surface damage is a new type of microelectronic packaging and interconnection technology. Therefore, laser ball soldering technology has extremely broad application prospects in the production of core components of 3C products.

Foreign ball solder welding equipment squeezes profit margins of enterprises

At present, China's laser ball soldering equipment has just started, and domestic strong manufacturers have purchased a large number of imported laser ball soldering equipment from Germany's PacTech for welding hard disk magnetic heads, mobile phone camera modules and other components. However, the equipment is expensive, and the maintenance costs are extremely high. Small and medium-sized enterprises cannot afford the high costs and still use manual welding. As a result, domestic electronics companies have been unable to produce high-end products, and a large number of low-end products have struggled to sell prices. At the same time, the high imported equipment has also squeezed the profit space of domestic electronic processing enterprises, resulting in the current situation that domestic electronic processing enterprises have high output values but low profit margins. Even though China is a big 3C electronic product producer, it lacks core and key technologies. At the same time, the import of a large number of equipment is not conducive to domestic equipment research and development, manufacturing, and is not conducive to the upgrading of 3C products.

Laser Ball Tin Soldering System Features

The development of laser ball tin soldering system can greatly reduce the cost of domestic electronic processing enterprises, upgrade technology, domestically promote the promotion of the national electronic information industry, and is conducive to the promotion of Industry 4.0 strategy.

The laser ball tin welding system adopts a multi-axis intelligent work platform, equipped with a synchronous CCD positioning and monitoring system, which can effectively guarantee the welding accuracy and yield. Adopting solder ball spray welding, high welding accuracy and reliable quality. 99.8% no virtual soldering through slicing experiments. Some are very sensitive to temperature or the welding area of the flexible board is connected, which can effectively guarantee the welding precision and high quality solder joints. The range is 350um ~ 760um. Using universal clamping equipment, product replacement is easy.

  • 7-axis intelligent working platform, equipped with synchronous CCD positioning and monitoring system, can effectively guarantee welding accuracy and yield.

  • With solder ball soldering, the welding accuracy is very high. For some soldering areas that are very sensitive to the temperature of traditional wave soldering and reflow soldering, the "laser ball soldering system" can effectively guarantee the welding accuracy and the amount of solder can be controlled.

  • The universal clamping device is used to make the product easy to replace, without welding residue, and free of cleaning.

  • CCD positioning system, for welding electronic products with high precision requirements, the advantages of this equipment are prominent. High efficiency and fast speed, the soldering time of a single solder ball is within 0.3s.

  • During processing, the laser does not make any contact with the welding object, so no mechanical stress is generated, which greatly weakens the thermal effect.

  • No additional flux or additional tools required. Welding products are flexible and diverse.

  • Eutectic solder and high-lead SnPb alloy solder can be used.

  • Lead-free solders such as SnAg, SnAgCu, AuSn, InSn, SnBi provide support.

  • On-line robot programming and processing, on-line docking station mechanical interface has been provided to complete the production line docking.

  • High speed and high throughput. The 2D image after welding can be used to check the welding status of the joint.



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