在焊接手机摄像头过程中无需工具接触，避免了工具与器件表面接触而造成器件表面损伤，加工精度更高,是一种新型的微电子封装与互连技术,可以完美助力机防抖摄像头OIS的发展。 Guide : With the realization of the camera module's anti-shake function, it also continues to challenge the existing processing and manufacturing technology. The laser ball tin soldering system does not require tool contact during the welding of the mobile phone camera, avoiding the contact between the tool and the surface of the device. It causes damage to the surface of the device and has higher processing accuracy. It is a new type of microelectronic packaging and interconnection technology, which can perfectly help the development of OIS of the camera.
The camera has been widely used in various electronic products, especially the rapid development of mobile phone, tablet and other industries, which has driven the rapid growth of the camera industry. In particular, mobile phones with cameras have always been admired. In the era of smartphones, camera performance has become an important selling point for smartphones. Various manufacturers have continuously upgraded camera performance in new models in order to enhance product competitiveness. In this way, many of the technologies used in professional cameras have also been applied to mobile phone cameras. For example: optical image stabilization.
At present, the anti-shake technology of mobile phone cameras mainly adopts: Optical Image Stabilizer (Optical Image Stabilizer, hereinafter referred to as OIS). Optical image stabilization is based on the structure of a special lens or CCD photosensitive element to minimize the operator's The image is unstable due to shake. As optical anti-shake technology, it does not make the body not shake, it relies on the special lens or the structure of the CCD sensor to minimize the operator's image instability due to shake during use.
So how do you achieve the OIS function of the camera anti-shake of the mobile phone? The anti-shake through the lens group mainly relies on the magnetic force to wrap the suspension lens, so as to effectively overcome the image blur caused by the camera vibration, which can play a role in digital cameras with large zoom lenses. The effect is more obvious. Generally, the gyroscope in the lens detects a small movement, and transmits the signal to the microprocessor to immediately calculate the amount of displacement that needs to be compensated, and then compensates according to the lens group's shake direction and displacement amount through the compensation lens group, which is effective Overcome image blur caused by camera vibration. The effect of the optical image stabilization function is quite obvious. In general, turning on this function can increase the shutter speed by 2-3 stops, so that the handheld shooting will not produce blurring. The effect is very obvious for beginners.
With the realization of the camera module's anti-shake function, it also continues to challenge the existing processing and manufacturing technologies. If it is only a simple pixel upgrade, the technical threshold is mainly process improvement and quality control, including stain control, light center Registration, tilt control, image color and function consistency correction, and image quality uniformity control. However, if it is an optical image stabilization product, the entire manufacturing process of the camera module will need to be upgraded and transformed, and the requirements for the accuracy of the production line, the cleanliness of the production plant and the design precision will be stricter.
There is no need for tool contact during the welding of the mobile phone camera, which avoids the surface damage of the device caused by the contact between the tool and the device surface, and the processing accuracy is higher. It is a new type of microelectronic packaging and interconnection technology, which can be perfectly applied to the mobile phone anti-shake camera. Processing, therefore, laser ball-tin soldering technology has extremely broad application prospects in the core device production of mobile phone cameras.
The laser ball tin welding system adopts a multi-axis intelligent work platform, equipped with a synchronous CCD positioning and monitoring system, which can effectively guarantee the welding accuracy and yield. Adopting solder ball spray welding, high welding accuracy and reliable quality. 99.8% no virtual soldering through slicing experiments. Some are very sensitive to temperature or the welding area of the flexible board is connected, which can effectively guarantee the welding precision and high quality solder joints. The application of solder balls The range is 350um ~ 760um. Using universal clamping equipment, product replacement is easy.
Laser ball soldering technology uses a single tin ball separated by a combination of laser and inert gas to spray molten tin material droplets at a certain temperature onto the metalized pad to precisely spray the surface of the area to be soldered. The heat carried by the ball droplets heats the pads to form bumps or to achieve bonding. The main advantage of this process is that it can achieve very small size interconnections, and the droplet size can be as small as tens of microns; the solder ball distribution and heating processes are performed simultaneously, and the production efficiency is high; through digital control of the solder balls, spraying can be achieved Precise position control to achieve extremely small-pitch interconnections; the heating of solder ball droplets is local and has no thermal impact on the package as a whole; in addition, no tool contact is required during the connection process, which prevents the device from contacting the surface of the device and causing the device Surface damage is a new type of microelectronic packaging and interconnection technology. Therefore, laser ball solder welding technology has extremely broad application prospects in the production of core devices for mobile phone camera products.
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